Crosstalk Reduction in High-Speed Microstrip Interconnects Using a Greek Key Guard Trace

Authors

Keywords:

crosstalk reduction, Greek key guard trace, High-speed PCB, Microstrip interconnects, Near-end crosstalk, Far-end crosstalk, Signal integrity

Abstract

This work presents a method for suppressing near-end crosstalk (NEXT) and far-end crosstalk (FEXT) in high-speed microstrip interconnects using a Greek key patterned defective microstrip guard trace. The structure increases effective capacitance and modifies the inductive path between coupled lines, improving electromagnetic isolation without increasing line spacing. A full parametric study is carried out in HFSS to evaluate the effect of defect width and unit-cell spacing on crosstalk behavior. The results show that a defect width of 0.01 mm with a spacing of 1.0 mm provides the strongest suppression, achieving NEXT of −57.53 dB and FEXT of −51.70 dB at 10 GHz. When compared with conventional guard traces, the proposed design delivers more than 60% improvement in NEXT and over 80% improvement in FEXT. Analysis shows saturation after 0.025 mm defect width, beyond which no significant improvement can be achieved. The proposed structure provides an optimal and compact method to reduce coupling effects in high-speed PCB designs with high density.

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Author Biographies

Gobinath Arumugam, Velammal College of Engineering and Technology

Gobinath A. received the B.E. and M.E. degrees in electronics and communication engineering from Velammal College of Engineering and Technology, Madurai, India. He is currently an Assistant Professor in the Department of Electronics and Communication Engineering at Velammal College of Engineering and Technology. He has over 13 years of teaching and research experience. His research interests include signal integrity, electromagnetic interference and compatibility (EMI/EMC), and high-speed PCB design. He has published and presented research papers in peer-reviewed journals and international conferences and is a Life Member of SEMCE (I)

Suresh Kumar Natarajan, RMK College of Engineering and Technology

Dr. Suresh Kumar N. received the B.E. degree in electronics and communication engineering from Thiagarajar College of Engineering, Madurai, India, the M.E. degree from Alagappa Chettiar College of Engineering, Karaikudi, India, and the Ph.D. degree from Madurai Kamaraj University, Madurai, India. He is currently a Professor in the Department of Electronics and Communication Engineering at RMK College of Engineering and Technology, Chennai, India. He has more than 38 years of teaching and research experience. His research interests include electromagnetic interference and compatibility (EMI/EMC), signal integrity, and high-speed PCB design. He has published extensively in peer-reviewed journals and international conferences and is a Life Member of IEEE, ISTE, IETE, and IE.

Rajeswari Packianathan, Velammal College of Engineering and Technology

Dr. Rajeswari P. received the B.E. degree in electronics and communication engineering from Madurai Kamaraj University, Madurai, India, the M.E. degree from Anna University, Chennai, India, and the Ph.D. degree in electromagnetic interference and compatibility (EMI/EMC) from Anna University, Chennai. She is currently a Professor in the Department of Electronics and Communication Engineering at Velammal College of Engineering and Technology, Madurai, India. She has more than 22 years of teaching and research experience. Her research interests include EMI/EMC, signal integrity, and wireless communication systems. She has published extensively in peer-reviewed journals and international conferences and has contributed to several funded research projects. She is a Life Member of ISTE, IETE, and the Society of EMC Engineers (India)

Mohamed Salah Karoui, Higher Institute of Applied Sciences and Technology of Mateur (ISSATM), University of Carthage, Tunisia

Dr. Eng. Karoui M.S. is an Associate Professor of Electrical Engineering at the Higher Institute of Applied Sciences and Technology of Mateur (ISSATM), University of Carthage, Tunisia. He obtained his Engineering Degree in Electrical Engineering from the National Engineering School of Sfax (ENIS) in 2003, followed by a Master’s degree in Electronics in 2004. He earned his Ph.D. in Electrical Engineering in 2010 and later received his HDR (Habilitation to Supervise Research) in 2021, both from ENIS. Dr. Karoui began his academic career at ISSATM as a Contractual Assistant in 2004. He then served as Assistant (2006–2010), Assistant Professor (2010–2013), and was promoted to Associate Professor in May 2022. His international experience includes a decade-long tenure as a Trainer (Assistant Professor) at Hail College of Technology in Saudi Arabia (2013–2023), and a subsequent position as Associate Professor at ICAM – Institut Catholique d'Arts et Métiers, Grand Paris Sud, France (2023–2024). In terms of research, Dr. Karoui was a member of the LETI Laboratory at ENIS from 2002 to 2024, and is currently affiliated with the Microwave Electronics Research Laboratory (MERLAB) at the Faculty of Sciences of Tunis. His research interests include wideband antenna design, bandwidth enhancement, RFID systems, and smart sensors for telemetry and IoT applications. He has supervised numerous Master’s and undergraduate theses, contributed to both national and international research projects, and serves as a reviewer for IEEE journals and conferences. Dr. Karoui is the author and co-author of 13 peer-reviewed journal articles and 9 international conference papers. An active contributor to the global scientific community, Dr. Karoui is a Senior Member of IEEE and a member of IEICE Japan. He also holds several leadership roles within IEEE, including Counselor of the IEEE ISSATM Student Branch, Advisor of the IEEE WIE ISSATM Student Chapter, Secretary of the IEEE MTT-S Tunisia Chapter, and Vice-Chair of the IEEE CRFID Tunisia Chapter.

References

Y. Wang, C. Li, and X. Li, “Reducing crosstalk between microstrip lines using CSR structures,” Engineering Reports, vol. 5, no. 7, Art. no. e12728, 2023, doi: 10.1002/eng2.12728.

C. Li, Y. Wang, and X. Li, “Crosstalk reduction between microstrip lines using TL-shaped defected microstrip structures,” Engineering Reports, vol. 5, no. 1, pp. 1–9, 2022.

W. Dai, W. Feng, and W. Che, “Reduction of UWB far-end crosstalk in microwave and millimeter-wave bands using periodically loaded transmission lines with discontinuous structured guard lines,” IEEE Trans. Plasma Sci., vol. 48, no. 7, pp. 2372–2383, Jul. 2020, doi: 10.1109/TPS.2020.3001201.

G. Arumugam, S.-K. Natarajan, P. Rajeswari, and M.-S. Karoui, “Near-end and far-end crosstalk reduction in high-speed signaling channels using periodical spiral resonator defected microstrip lines in high-performance printed circuit boards,” IEICE Electron. Express, vol. 22, no. 1, Art. no. 20240268, Jan. 2025, doi: 10.1587/elex.22.20240268.

Gobinath, et al., “Reduction of near-end and far-end crosstalk in microwave and millimeter-wave bands using meander-shaped defected microstrip structures,” J. Phys.: Conf. Ser., vol. 2466, Art. no. 012016, 2023, doi: 10.1088/1742-6596/2466/1/012016.

A Gobinath, et al., “Reduction of electromagnetic coupling between parallel high-speed interconnects using defected microstrip structures,” Mater. Today Proc., 2023, doi: 10.1016/j.matpr.2023.08.201.

R. Packianathan and G. Arumugam, “Performance analysis of microstrip line interconnect structures with novel guard traces as parallel links for high-speed DRAM interfaces,” Wireless Pers. Commun., vol. 112, no. 1, pp. 261–271, 2020, doi: 10.1007/s11277-020-07025-7.

J. Lim, S. Lee, Y. Jeong, and J. Lee, “A novel method using a rectangular groove to reduce far-end crosstalk in microstrip lines covered with a dielectric layer,” IEEE Access, vol. 7, pp. 93643–93652, 2019.

X.-B. Yu, Q.-M. Cai, Y. Ren, X. Ye, and J. Fan, “Study of thickening solder mask coated microstrip lines on high-speed PCBs for crosstalk reduction in DDR5,” in Proc. IEEE Int. Symp. Electromagn. Compat. Signal/Power Integrity, Jul./Aug. 2020, pp. 575–577.

X. Gao, H. Zhang, P. He, et al., “Crosstalk suppression based on mode mismatch between spoof SPP transmission line and microstrip,” IEEE Trans. Compon., Packag. Manuf. Technol., vol. 9, pp. 2267–2275, 2019, doi: 10.1109/TCPMT.2019.2931373.

S. Yong, V. Khilkevich, X. Cai, et al., “Comprehensive and practical way to look at far-end crosstalk for transmission lines with lossy conductor and dielectric,” IEEE Trans. Electromagn. Compat., vol. 62, no. 2, pp. 510–520, Apr. 2020, doi: 10.1109/TEMC.2019.2902070.

Y. Liu, S. Yong, Y. Guo, et al., “An empirical modeling of far-end crosstalk and insertion loss in microstrip lines,” IEEE Trans. Signal Power Integr., vol. 1, no. 2, pp. 130–139, Jun. 2022, doi: 10.1109/TSIPI.2022.3214172.

S. S. Sharma, A. K. Pandey, and T. Mishra, “Electromagnetic field study of partially coupled microstrip line at different frequency,” in Proc. 2nd Int. Conf. Micro-Electronics Telecommun. Eng. (ICMETE), Ghaziabad, India, 2018, pp. 36–38, doi: 10.1109/ICMETE.2018.00021.

R. Balakrishnan, S. A. Thomas, and S. Sharan, “Crosstalk and EMI reduction using enhanced guard trace technique,” in Proc. IEEE Elect. Design Adv. Packag. Syst. Symp. (EDAPS), Honolulu, HI, USA, 2018, pp. 1–3, doi: 10.1109/EDAPS.2018.8680903.

J. Lim, S. Lee, and J. Lee, “A novel layer shaping method to reduce far-end crosstalk noise in microstrip lines using a 3D printer,” in Proc. 4th Aust. Microw. Symp. (AMS), Sydney, NSW, Australia, 2020, pp. 1–2, doi: 10.1109/AMS48904.2020.9059422.

F. D. Mbairi, W. P. Siebert, and H. Hesselbom, “High-frequency transmission line crosstalk reduction using spacing rules,” IEEE Trans. Compon. Packag. Technol., vol. 31, no. 3, pp. 601–610, Sep. 2008, doi: 10.1109/TCAPT.2008.2001163.

L. Zhang, Q. Cai, X. Yu, et al., “Far-end crosstalk mitigation for microstrip lines in high-speed PCBs,” in Proc. Cross Strait Quad-Regional Radio Sci. Wireless Technol. Conf., Fuzhou, China, 2019, pp. 1–3, doi: 10.1109/CSQRWC.2019.8799209.

W. Jiang, X.-D. Cai, B. Sen, and G. Wang, “Equation-based solutions to coupled, asymmetrical, lossy, and nonuniform microstrip lines for tab routing applications,” IEEE Trans. Electromagn. Compat., vol. 61, no. 2, pp. 548–557, Apr. 2019.

L. K. Baghel, S. Kumar, S. A. Sis, and J. Kim, “Crosstalk reduction in coupled microstrip lines using TT-shaped defected microstrip structures,” in Proc. Joint Asia-Pac. Int. Symp. Electromagn. Compat. Int. Conf. Electromagn. Interference Compat., May 2023, pp. 1–4.

J. Ge, R. Floyd, A. Khan, and G. Wang, “High-performance interconnects with reduced far-end crosstalk for high-speed ICs and communication systems,” IEEE Trans. Compon., Packag. Manuf. Technol., vol. 13, no. 7, pp. 1013–1020, Jul. 2023.

X. Liu, et al., “Equivalent circuit model of crosstalk reduction in parallel transmission lines with defected microstrip structures,” in Proc. Cross Strait Quad-Regional Radio Sci. Wireless Technol. Conf., Jul. 2018, pp. 1–2.

Li, Y. Wang, and X. Li, “Crosstalk reduction between microstrip lines using TL-shaped defected microstrip structures,” Engineering Reports, vol. 5, no. 1, Art. no. e12559, 2023.

R. Li, Y. Wang, W. Yang, and X. Li, “G-shaped defected microstrip structure-based method of reducing crosstalk of coupled microstrip lines,” Prog. Electromagn. Res. M, vol. 105, pp. 99–109, 2021.

Y. V., G. N. Alsath, and M. Kanagasabai, “Defected microstrip structure-based near-end and far-end crosstalk mitigation in high-speed PCBs for mixed signals,” Microelectronics Int., vol. 41, no. 1, pp. 16–25, 2024.

Published

2026-05-21

How to Cite

Arumugam, G., Natarajan, S. K. ., Packianathan, R., & Karoui, M. S. (2026). Crosstalk Reduction in High-Speed Microstrip Interconnects Using a Greek Key Guard Trace. IEEE Latin America Transactions, 24(7), 724–734. Retrieved from https://latamt.ieeer9.org/index.php/transactions/article/view/10483

Issue

Section

Electronics