A Prototype of a Termography Equipment
Keywords:
Thermographic equipment, prototype, thermal imageAbstract
Thermography is a technique for graphically recording the temperature of bodies above -273 oC and capable of emitting infrared radiation. This feature allows for the study of temperature behavior in different objects, structures, and surfaces over time. This work aims to describe the conception of an opensource thermographic equipment. This paper covers the stages of construction of the physical structure, data acquisition, movement system, electronics, control, electrical system, and graphical interface for equipment control and image formation. The proposed equipment has an accuracy of +/- 1 oC, at a temperature between 0 oC and 50 oC, a usable reading area of 20 x 22 cm, producing images with 32 x 36 pixels, and capable of reading objects with temperatures between 0 oC and 300 oC. The equipment proposed here works for studies of thermography in small bodies, such as the human hand, small objects with heat variation, electronic circuits, and components and portable devices (e.g. smartphones, lithium-ion batteries, tablets), just to cite a few. The thermal images produced by the proposed equipment have well-defined contours and uniform thermal characteristics.
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S. and S. Mohan, “A low cost thermal imaging system for medicaldiagnostic applications,” in International Conference on Smart Technolo-gies and Management for Computing, Communication, Controls, Energyand Materials (ICSTM), 2015, pp. 621–623.
J. M. Callegari, L. Gusman, D. do Carmo Mendonc ̧a, W. Amorim,I. Alves, H. Pereira, and F. Pinto, “Detection of stressed electroniccomponents in pv inverter using thermal imaging,”IEEE Latin AmericaTransactions, p. 2, 10 2020.
B. Araújo, “Termografia infravermelha,” 2014.
K. Chrzanowski,Non-contact Thermometry: Measurement Errors, ser.RDT series. SPIE Polish Chapter, 2001.
A. Gowen, T. Brijesh kumar, P. Cullen, K. Mcdonnell, and C. O’Donnell,“Applications of thermal imaging in food quality and safety assessment,”Trends in Food Science Technology, vol. 21, pp. 190–200, 2010.
J. R. Martinez-de Dios and A. Ollero, “Automatic detection of windowsthermal heat losses in buildings using uavs,” inWorld AutomationCongress, 2006, pp. 1–6.
M. Jadin, K. Ghazali, and S. Taib, “Thermal condition monitoring ofelectrical installations based on infrared image analysis,” inInternationalElectronics, Communications and Photonics Conference, 2013, pp. 1–6.
R. Siegel, “Land mine detection,”IEEE Instrumentation MeasurementMagazine, vol. 5, pp. 22–28, 2003.
A. Kumar and S. S., “Design and development of a high-performance3rd-generation handheld thermal camera,” inInfrared Systems andPhotoelectronic Technology, vol. 5563, International Society for Opticsand Photonics. SPIE, 2004, pp. 167–173.
T. Schimert, N. Cunningham, G. Francisco, R. Gooch, J. Gooden,P. McCardel, B. Neal, B. Ritchey, J. Rife, A. Syllaios, J. Tregilgas, J. B.III, J. Gilstrap, and S. Ropson, “Low-cost low-power uncooled 120x160a-si-based microinfrared camera for law enforcement applications,”inEnabling Technologies for Law Enforcement and Security, S. K.Bramble, E. M. Carapezza, L. I. Rudin, L. I. Rudin, and S. K. Bramble,Eds., vol. 4232, International Society for Optics and Photonics. SPIE,2001, pp. 187–194.
M. Mansi, M. Brookfield, S. Porter, I. Edwards, B. Bold, J. Shannon,P. Lambkin, and A. Mathewson, “Authentic: a very low-cost infrareddetector and camera system,” inInfrared Technology and ApplicationsXXVIII, vol. 4820, International Society for Optics and Photonics. SPIE,2003, pp. 227–238.
M. Wu, J. Cook, R. DeVito, J. Li, E. Ma, R. Murano, N. Nemchuk,M. Tabasky, and M. Wagner, “Novel low-cost uncooled infrared camera,”inInfrared Technology and Applications XXXI, vol. 5783, InternationalSociety for Optics and Photonics. SPIE, 2005, pp. 496–505.
H. Geoffray and F. Guerin, “Measured performance of a low-cost thermalinfrared pushbroom camera based on uncooled microbolometer fpa forspace applications,” inSensors, Systems, and Next-Generation SatellitesV, vol. 4540, International Society for Optics and Photonics.SPIE,2001, pp. 298–308.
A. Schaufelbuhl, N. Schneeberger, U. Munch, M. Waelti, O. Paul,O. Brand, H. Baltes, C. Menolfi, Q. Huang, E. Doering, and M. Loepfe,“Uncooled low-cost thermal imager based on micromachined cmosintegrated sensor array,”Microelectromechanical Systems, Journal of,vol. 10, pp. 503–510, 2002.
A. Xhafa, “Development and evaluation of a low-cost infrared thermalcamera for industrial predictive maintenance applications,” Master’sthesis, Universitat Polit ́ecnica de Catalunya, 2017.
G. Monte, D. Marasco, L. Solorzano, J. Vallejos, and R. Bufanio, “Smartsensing of systems thermal behavior using low cost infrared cameras,”inIECON - 45th Annual Conference of the IEEE Industrial ElectronicsSociety, 2019, pp. 5544–5549.
D. Garigali Pestana, F. Mendonc ̧a, and F. Morgado-Dias, “A low-cost fpga based thermal imaging camera for fault detection in pvpanels,” inInternational Conference on Internet of Things for the GlobalCommunity (IoTGC), 2017, pp. 1–6.
J. Leizi, X. Zhao, and D. Daming, “Design for temperature measurementsystem based on smart phone and infrared thermal camera core,” inInter-national Conference on Intelligent Systems Research and MechatronicsEngineering (ISRME), 2015, pp. 1336–1339.
A. Jaakkola, J. Hyypp ̈a, A. Kukko, X. Yu, H. Kaartinen, M. Lehtom ̈aki,and Y. Lin, “A low-cost multi-sensoral mobile mapping system andits feasibility for tree measurements,”Journal of Photogrammetry andRemote Sensing, vol. 65, pp. 514–522, 2010
M. Ljubenovic and M. Milic, “Arduino-based non-contact system forthermal-imaging of electronic circuits,” inZooming Innovation in Con-sumer Technologies Conference, 2018, pp. 62–67.
S. Kockara, T. Halic, C. Hudson, A. Loney, and A. Crawford, “Portablemalignant lesion detection with low cost mobile infrared thermography,”inIEEE Innovations in Technology Conference, 2014, pp. 1–5.
C. Chirila and L. Szolga, “Development of a thermal camera using a lownoise high speed far infrared camera,” inIEEE International Symposiumfor Design and Technology in Electronic Packaging, 2019, pp. 183–193.
J. Broggio, “Proposta de sistema de alerta de risco de insolac ̧ ̃ao ehipertermia em crianc ̧a dentro de autom ́ovel, com sensor infraver-melho,” Master’s thesis, Instituto de Engenharia Biom ́edica, campusFernand ́opolis, 2017.
J. Lev, V. Shapoval, J. Bartoska, and F. Kumh ́ala, “Low-cost infraredsensor for wildlife detection in vegetation,”Research in AgriculturalEngineering, vol. 63, pp. S13–S17, 2017.
L. Pinheiro, “Tabelas de vigas: Deslocamentos e momentos de engasta-mento perfeito,” 2010.
F. Beer, J. Dewolf, and D. Mazurek,Est ́atica e Mecˆanica dos Materiais.Editora Bookman, 2013.
S. Vidas, P. Moghadam, and M. Bosse, “3d thermal mapping of buildinginteriors using an rgb-d and thermal camera,” 2013, pp. 2303–2310.
I. Rocco, M. Antunes, D. Aouada, and B. Ottersten, “Rgb-d and thermalsensor fusion,” inVISIGRAPP, 2016, pp. 1–9
